Tokyo Electron (OTCMKTS:TOELY) Shares Gap Down – Here’s What Happened

Tokyo Electron Ltd. (OTCMKTS:TOELYGet Free Report) shares gapped down before the market opened on Friday . The stock had previously closed at $91.83, but opened at $88.14. Tokyo Electron shares last traded at $88.80, with a volume of 34,585 shares traded.

Wall Street Analysts Forecast Growth

Separately, Zacks Research cut shares of Tokyo Electron from a “hold” rating to a “strong sell” rating in a research report on Monday, September 22nd. One investment analyst has rated the stock with a Strong Buy rating and one has given a Sell rating to the stock. According to MarketBeat.com, the stock currently has a consensus rating of “Moderate Buy”.

Check Out Our Latest Stock Report on TOELY

Tokyo Electron Trading Down 2.2%

The business’s fifty day moving average price is $77.88 and its 200 day moving average price is $78.54. The firm has a market capitalization of $82.78 billion, a price-to-earnings ratio of 23.10 and a beta of 1.80.

Tokyo Electron (OTCMKTS:TOELYGet Free Report) last posted its quarterly earnings data on Thursday, July 31st. The company reported $0.86 earnings per share for the quarter, missing analysts’ consensus estimates of $0.89 by ($0.03). The firm had revenue of $3.80 billion during the quarter, compared to analysts’ expectations of $4.10 billion. Tokyo Electron had a net margin of 22.07% and a return on equity of 28.97%. Tokyo Electron has set its FY 2025 guidance at 6.700-6.700 EPS. As a group, sell-side analysts forecast that Tokyo Electron Ltd. will post 3.23 earnings per share for the current fiscal year.

Tokyo Electron Company Profile

(Get Free Report)

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.

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