Disco Corp (OTCMKTS:DSCSY) Short Interest Update

Disco Corp (OTCMKTS:DSCSY) was the target of a significant decline in short interest during the month of July. As of July 15th, there was short interest totaling 10,600 shares, a decline of 90.9% from the June 30th total of 115,925 shares. Based on an average trading volume of 720,554 shares, the short-interest ratio is presently 0.0 days. Currently, 0.0% of the company’s shares are short sold.

Disco Trading Down 6.1%

Shares of OTCMKTS DSCSY traded down $2.38 during midday trading on Friday, hitting $36.37. The company’s stock had a trading volume of 187,313 shares, compared to its average volume of 303,400. The business’s 50 day moving average is $45.17 and its two-hundred day moving average is $44.31. Disco has a 12-month low of $24.94 and a 12-month high of $58.00. The firm has a market cap of $39.46 billion, a P/E ratio of 44.35 and a beta of 1.50.

Disco (OTCMKTS:DSCSY) last issued its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. The firm had revenue of $717.28 million during the quarter. Disco had a return on equity of 25.27% and a net margin of 30.95%. On average, analysts predict that Disco will post 1.05 earnings per share for the current fiscal year.

Analyst Upgrades and Downgrades

Separately, Zacks Research downgraded shares of Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One analyst has rated the stock with a Hold rating, According to data from MarketBeat, Disco presently has a consensus rating of “Hold”.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.