BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Should You Sell?

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s share price gapped down prior to trading on Thursday . The stock had previously closed at $330.76, but opened at $317.00. BE Semiconductor Industries shares last traded at $313.8320, with a volume of 1,239 shares.

Wall Street Analysts Forecast Growth

A number of brokerages recently issued reports on BESIY. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, May 15th. Finally, Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Five investment analysts have rated the stock with a Buy rating and five have assigned a Hold rating to the company’s stock. According to MarketBeat, the company has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Trading Down 5.4%

The company’s 50-day moving average is $320.08 and its 200-day moving average is $244.11. The company has a debt-to-equity ratio of 1.11, a quick ratio of 4.17 and a current ratio of 4.74. The firm has a market cap of $21.82 billion, a price-to-earnings ratio of 136.18 and a beta of 1.97.

BE Semiconductor Industries (OTCMKTS:BESIY) last released its earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, hitting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.The company had revenue of $216.51 million during the quarter, compared to the consensus estimate of $220.77 million. On average, research analysts predict that BE Semiconductor Industries NV will post 4.45 earnings per share for the current year.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.