Disco (OTCMKTS:DSCSY) Sees Strong Trading Volume – Still a Buy?

Disco Corp (OTCMKTS:DSCSYGet Free Report) shares saw strong trading volume on Friday . Approximately 329,944 shares were traded during trading, an increase of 16% from the previous session’s volume of 284,025 shares.The stock last traded at $47.91 and had previously closed at $49.14.

Wall Street Analyst Weigh In

Separately, Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the stock. According to MarketBeat.com, Disco presently has an average rating of “Buy”.

Check Out Our Latest Research Report on DSCSY

Disco Stock Down 5.5%

The firm has a market capitalization of $52.85 billion, a price-to-earnings ratio of 59.41 and a beta of 1.54. The company has a 50-day moving average price of $46.08 and a 200-day moving average price of $42.32.

Disco (OTCMKTS:DSCSYGet Free Report) last posted its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. The business had revenue of $848.13 million during the quarter, compared to the consensus estimate of $771.53 million. Disco had a net margin of 30.95% and a return on equity of 25.27%. As a group, analysts forecast that Disco Corp will post 1.05 earnings per share for the current year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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