Disco Corp (OTCMKTS:DSCSY) Sees Large Drop in Short Interest

Disco Corp (OTCMKTS:DSCSY) saw a significant decline in short interest in the month of May. As of May 29th, there was short interest totaling 15,431 shares, a decline of 90.9% from the May 14th total of 168,911 shares. Based on an average trading volume of 522,973 shares, the short-interest ratio is presently 0.0 days. Approximately 0.0% of the shares of the company are sold short.

Wall Street Analysts Forecast Growth

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the company’s stock. Based on data from MarketBeat.com, the company currently has a consensus rating of “Buy”.

Disco Stock Performance

Shares of Disco stock traded up $0.40 during trading hours on Tuesday, hitting $44.34. The company’s stock had a trading volume of 193,846 shares, compared to its average volume of 199,254. The business has a 50 day moving average price of $43.80 and a two-hundred day moving average price of $40.41. Disco has a 12-month low of $22.92 and a 12-month high of $52.99. The company has a market cap of $48.10 billion, a PE ratio of 54.07 and a beta of 1.54.

Disco (OTCMKTS:DSCSY) last announced its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a return on equity of 25.27% and a net margin of 30.95%.The business had revenue of $848.13 million for the quarter, compared to the consensus estimate of $771.53 million. As a group, research analysts anticipate that Disco will post 1.07 earnings per share for the current year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.