Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) saw unusually-strong trading volume on Friday . Approximately 18,245 shares traded hands during trading, an increase of 166% from the previous session’s volume of 6,870 shares.The stock last traded at $317.98 and had previously closed at $319.66.
Analyst Ratings Changes
Several analysts have issued reports on BESIY shares. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, May 15th. Zacks Research raised BE Semiconductor Industries to a “strong-buy” rating in a report on Thursday, April 23rd. Finally, Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. One analyst has rated the stock with a Strong Buy rating, five have issued a Buy rating and four have issued a Hold rating to the company. Based on data from MarketBeat, the stock presently has a consensus rating of “Moderate Buy”.
Check Out Our Latest Stock Analysis on BESIY
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, hitting analysts’ consensus estimates of $0.76. The firm had revenue of $216.51 million during the quarter, compared to analyst estimates of $220.77 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. On average, sell-side analysts forecast that BE Semiconductor Industries NV will post 4.46 earnings per share for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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