SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) to Issue $0.12 Dividend

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) declared a dividend on Wednesday, September 2nd. Investors of record on Thursday, September 3rd will be paid a dividend of 0.1206 per share on Friday, September 4th. The ex-dividend date is Thursday, September 3rd.

SEI High Yield Bond & Alternative Credit ETF Trading Up 0.0%

Shares of NASDAQ LEND opened at $24.88 on Thursday. SEI High Yield Bond & Alternative Credit ETF has a 12-month low of $24.79 and a 12-month high of $25.29. The firm’s 50-day simple moving average is $24.98 and its 200 day simple moving average is $21.09.