BE Semiconductor Industries (OTCMKTS:BESIY) Trading Down 8% After Earnings Miss

BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) was down 8% during trading on Thursday following a weaker than expected earnings announcement. The company traded as low as $261.00 and last traded at $261.00. 1,664 shares were traded during trading, a decline of 79% from the average daily volume of 7,745 shares. The stock had previously closed at $283.80.

The technology company reported $1.29 earnings per share (EPS) for the quarter, missing the consensus estimate of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.

Wall Street Analysts Forecast Growth

A number of equities analysts have issued reports on the company. Zacks Research downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Finally, Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Five equities research analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the company. According to data from MarketBeat.com, BE Semiconductor Industries presently has an average rating of “Moderate Buy”.

Check Out Our Latest Analysis on BESIY

BE Semiconductor Industries Price Performance

The company has a current ratio of 4.74, a quick ratio of 4.17 and a debt-to-equity ratio of 1.11. The company has a market cap of $18.93 billion, a PE ratio of 118.10 and a beta of 1.97. The firm has a 50 day moving average of $316.28 and a two-hundred day moving average of $257.29.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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