Disco Corp (OTCMKTS:DSCSY) Sees Significant Increase in Short Interest

Disco Corp (OTCMKTS:DSCSY) saw a large growth in short interest in the month of June. As of June 30th, there was short interest totaling 115,925 shares, a growth of 486.9% from the June 15th total of 19,753 shares. Currently, 0.0% of the shares of the stock are sold short. Based on an average trading volume of 782,291 shares, the short-interest ratio is presently 0.1 days.

Disco Stock Performance

Disco stock traded down $0.01 during trading hours on Friday, hitting $45.42. 109,302 shares of the stock were exchanged, compared to its average volume of 374,458. The stock has a market capitalization of $49.27 billion, a P/E ratio of 55.39 and a beta of 1.50. The business’s 50-day moving average is $46.19 and its two-hundred day moving average is $43.51. Disco has a 12 month low of $24.94 and a 12 month high of $58.00.

Disco (OTCMKTS:DSCSY) last posted its earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. The company had revenue of $848.13 million during the quarter, compared to analysts’ expectations of $771.53 million. Disco had a net margin of 30.95% and a return on equity of 25.27%. On average, equities analysts predict that Disco will post 1.05 earnings per share for the current fiscal year.

Analysts Set New Price Targets

Separately, Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One research analyst has rated the stock with a Hold rating, According to MarketBeat.com, the company currently has an average rating of “Hold”.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.