BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s share price reached a new 52-week high during mid-day trading on Tuesday . The company traded as high as $341.70 and last traded at $340.48, with a volume of 1678 shares trading hands. The stock had previously closed at $305.21.
Wall Street Analyst Weigh In
A number of equities research analysts recently issued reports on BESIY shares. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Zacks Research raised shares of BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. Berenberg Bank raised shares of BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Finally, Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. One research analyst has rated the stock with a Strong Buy rating, five have issued a Buy rating and four have issued a Hold rating to the company’s stock. According to MarketBeat, BE Semiconductor Industries has an average rating of “Moderate Buy”.
View Our Latest Report on BE Semiconductor Industries
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, hitting the consensus estimate of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The company had revenue of $216.51 million for the quarter, compared to analysts’ expectations of $220.77 million. On average, sell-side analysts predict that BE Semiconductor Industries NV will post 4.46 EPS for the current year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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