Applied Materials, Inc. (NASDAQ:AMAT – Get Free Report) declared a quarterly dividend on Thursday, March 12th. Investors of record on Thursday, May 21st will be paid a dividend of 0.53 per share by the manufacturing equipment provider on Thursday, June 11th. This represents a c) annualized dividend and a yield of 0.5%. The ex-dividend date of this dividend is Thursday, May 21st. This is a 15.2% increase from Applied Materials’s previous quarterly dividend of $0.46.
Applied Materials has increased its dividend by an average of 0.1%per year over the last three years and has increased its dividend every year for the last 8 years. Applied Materials has a dividend payout ratio of 21.0% indicating that its dividend is sufficiently covered by earnings. Analysts expect Applied Materials to earn $14.41 per share next year, which means the company should continue to be able to cover its $2.12 annual dividend with an expected future payout ratio of 14.7%.
Applied Materials Stock Performance
Shares of AMAT stock opened at $413.57 on Tuesday. The firm has a market cap of $328.21 billion, a price-to-earnings ratio of 38.83, a PEG ratio of 1.92 and a beta of 1.66. The company’s 50 day moving average is $380.43 and its 200 day moving average is $321.37. The company has a quick ratio of 1.80, a current ratio of 2.51 and a debt-to-equity ratio of 0.22. Applied Materials has a 52-week low of $153.47 and a 52-week high of $448.45.
Applied Materials Company Profile
Applied Materials, Inc is a U.S.-based supplier of equipment, services and software used to manufacture semiconductor chips, flat panel displays and other advanced materials. Headquartered in Santa Clara, California, the company designs and sells capital equipment and related technologies that enable production of integrated circuits, display panels and materials used across the electronics supply chain.
Applied Materials’ offerings include process equipment and factory software that support critical steps in device fabrication, such as deposition, etch, implantation, inspection and metrology, as well as systems for packaging and advanced heterogeneous integration.
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