BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) has been assigned a consensus recommendation of “Buy” from the nine ratings firms that are currently covering the company, MarketBeat Ratings reports. Two equities research analysts have rated the stock with a hold recommendation, five have assigned a buy recommendation and two have issued a strong buy recommendation on the company.
BESIY has been the topic of several research analyst reports. Berenberg Bank upgraded BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research note on Tuesday, August 4th. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Finally, Zacks Research raised BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research report on Wednesday, July 29th.
View Our Latest Analysis on BE Semiconductor Industries
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its earnings results on Thursday, July 23rd. The technology company reported $1.29 earnings per share for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01). BE Semiconductor Industries had a net margin of 28.42% and a return on equity of 46.44%. The company had revenue of $290.52 million for the quarter, compared to the consensus estimate of $285.58 million. As a group, equities analysts forecast that BE Semiconductor Industries will post 4.83 earnings per share for the current year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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