Disco Corp (OTCMKTS:DSCSY) Short Interest Update

Disco Corp (OTCMKTS:DSCSY) saw a significant growth in short interest during the month of July. As of July 31st, there was short interest totaling 22,522 shares, a growth of 112.5% from the July 15th total of 10,600 shares. Currently, 0.0% of the company’s shares are short sold. Based on an average daily trading volume, of 886,482 shares, the short-interest ratio is presently 0.0 days.

Disco Stock Down 2.7%

OTCMKTS:DSCSY opened at $40.71 on Friday. The stock’s fifty day moving average is $43.91 and its two-hundred day moving average is $44.29. Disco has a 52 week low of $24.94 and a 52 week high of $58.00. The stock has a market capitalization of $44.16 billion, a price-to-earnings ratio of 46.79 and a beta of 1.55.

Disco (OTCMKTS:DSCSY) last released its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 EPS for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%.The business had revenue of $717.28 million during the quarter. On average, sell-side analysts expect that Disco will post 1.05 EPS for the current fiscal year.

Analyst Ratings Changes

DSCSY has been the subject of a number of recent research reports. Jefferies Financial Group raised Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. Zacks Research cut shares of Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One research analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company. According to MarketBeat.com, the stock presently has a consensus rating of “Moderate Buy”.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.