BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Up – What’s Next?

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s share price gapped up before the market opened on Wednesday . The stock had previously closed at $196.7850, but opened at $217.2920. BE Semiconductor Industries shares last traded at $217.2920, with a volume of 465 shares trading hands.

Wall Street Analyst Weigh In

A number of equities research analysts have issued reports on the company. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 13th. Sanford C. Bernstein restated an “outperform” rating on shares of BE Semiconductor Industries in a research report on Sunday, January 4th. Needham & Company LLC raised shares of BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Finally, Berenberg Bank upgraded shares of BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. Five analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the stock. According to data from MarketBeat, BE Semiconductor Industries presently has an average rating of “Hold”.

BE Semiconductor Industries Trading Up 2.0%

The stock’s 50-day moving average price is $209.03 and its 200 day moving average price is $178.31. The company has a debt-to-equity ratio of 1.22, a current ratio of 5.55 and a quick ratio of 4.88. The firm has a market capitalization of $15.84 billion, a PE ratio of 116.83 and a beta of 1.81.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.