Disco (OTCMKTS:DSCSY) Sees Unusually-High Trading Volume – Should You Buy?

Shares of Disco Corp (OTCMKTS:DSCSYGet Free Report) saw an uptick in trading volume on Friday . 252,159 shares traded hands during mid-day trading, an increase of 15% from the previous session’s volume of 218,837 shares.The stock last traded at $37.89 and had previously closed at $37.89.

Wall Street Analysts Forecast Growth

Separately, Zacks Research raised Disco from a “strong sell” rating to a “hold” rating in a research report on Tuesday, November 11th. One investment analyst has rated the stock with a Strong Buy rating and two have issued a Hold rating to the company’s stock. According to data from MarketBeat, the company currently has a consensus rating of “Moderate Buy”.

View Our Latest Stock Report on Disco

Disco Stock Up 0.1%

The company has a market capitalization of $41.15 billion, a price-to-earnings ratio of 49.28 and a beta of 1.54. The business has a fifty day simple moving average of $30.94 and a two-hundred day simple moving average of $30.58.

Disco (OTCMKTS:DSCSYGet Free Report) last posted its earnings results on Wednesday, October 29th. The company reported $0.20 EPS for the quarter. Disco had a return on equity of 26.06% and a net margin of 30.85%.The business had revenue of $709.55 million during the quarter. As a group, equities analysts predict that Disco Corp will post 0.7 earnings per share for the current fiscal year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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