TheStreet lowered shares of ACM Research (NASDAQ:ACMR) from a b- rating to a c+ rating in a report issued on Friday morning, TheStreetRatingsTable reports.
A number of other equities analysts also recently commented on the stock. Nomura boosted their target price on shares of ACM Research from $33.00 to $70.00 and gave the stock a buy rating in a research note on Wednesday, January 22nd. Morgan Stanley assumed coverage on shares of ACM Research in a report on Tuesday, January 21st. They issued an overweight rating and a $45.00 target price for the company. Stifel Nicolaus increased their price target on shares of ACM Research from $22.00 to $30.00 and gave the stock a buy rating in a report on Tuesday, January 14th. Benchmark increased their price target on shares of ACM Research from $19.00 to $30.00 and gave the stock a buy rating in a report on Tuesday, January 14th. Finally, Zacks Investment Research cut shares of ACM Research from a buy rating to a hold rating in a report on Friday, January 10th. One investment analyst has rated the stock with a sell rating, one has issued a hold rating and six have given a buy rating to the company’s stock. The company currently has a consensus rating of Buy and a consensus target price of $38.25.
Shares of NASDAQ ACMR opened at $38.61 on Friday. The firm has a market cap of $588.51 million, a price-to-earnings ratio of 42.43 and a beta of -0.66. The company has a quick ratio of 2.14, a current ratio of 2.91 and a debt-to-equity ratio of 0.03. ACM Research has a 52-week low of $9.02 and a 52-week high of $51.20. The business’s 50 day moving average is $29.78 and its two-hundred day moving average is $18.51.
About ACM Research
ACM Research, Inc, together with its subsidiaries, develops, manufactures, and sells single-wafer wet cleaning equipment for enhancing the manufacturing process and yield for integrated chips worldwide. It offers space alternated phase of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces in a uniform manner on a microscopic level; timely energized bubble oscillation cleaning equipment for two-dimensional and three-dimensional patterned wafers at advanced process nodes; and custom-made wafer assembly and packaging equipment.
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